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Review explores laser fabrication techniques for metasurfaces, addressing efficiency and precision challenges.
Metasurfaces, as artificially engineered two‐dimensional platforms for precise electromagnetic wave manipulation, have revealed revolutionary potential across imaging, sensing, and communication domains. Nevertheless, their practical adoption remains hindered by persistent challenges in achieving high‑precision and high‑efficiency fabrication of subwavelength architectures. Laser‑based processing emerges as a pivotal strategy to address these constraints, leveraging its unparalleled advantages including maskless operation, genuine three‑dimensional processing freedom, and broad material compatibility. This review systematically elucidates recent progress in laser‑fabricated metasurfaces. It begins with a delineation of the fundamental physical mechanisms governing femtosecond laser interactions with critical material systems, such as metals, dielectrics, and semiconductors. Subsequently, a comprehensive overview is presented of three principal laser processing modalities—subtractive, modificative, and additive approaches—analyzing their operational principles, performance benchmarks, and application landscapes. Special emphasis is placed on key enabling technologies, including beam shaping, aberration correction, and thermal management at hetero‑interfaces, which substantially augment fabrication capabilities and functional diversity. Finally, a prospective analysis is provided of outstanding challenges and future research trajectories toward industrialization, highlighting issues such as large‑area uniformity, multi‑material integration, and intelligent manufacturing paradigms.
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Wei et al. (2026) studied this question.
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