What question did this study set out to answer?

Design and evaluate high-speed, low-power thermooptic switches fabricated on a wafer-bonded thin silicon-on-insulator platform.

September 30, 2003IEEE Photonics Technology Letters

Fast and low-power thermooptic switch on thin silicon-on-insulator

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Authors

RERichard L. EspinolaUnited States Naval Research Laboratory MTMing-Chun TsaiFeng Chia University JYJames T. YardleyUniversity of Bath

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Implication

Experimental study demonstrates a low-power thermooptic switch on thin silicon-on-insulator, indicating high viability for fast photonic integrated circuits.

Key Points

Design and evaluate high-speed, low-power thermooptic switches fabricated on a wafer-bonded thin silicon-on-insulator platform.
Fabricated Mach-Zehnder interferometer switches using a wafer-bonded thin-silicon-on-insulator materials system.
Patterned single-mode strip waveguides with cross-sectional dimensions of 0.26 × 0.6 μm² configured for operation at a 1.55-μm wavelength.
Achieved an operational switching power of 50 mW.
Demonstrated a fast switching dynamic with a rise time under 3.5 μs.

Cite This Study

Espinola et al. (2003) studied this question.

synapsesocial.com/papers/6a0254cbf58aa273abb36598 https://doi.org/10.1109/lpt.2003.818246

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Implication

Experimental study demonstrates a low-power thermooptic switch on thin silicon-on-insulator, indicating high viability for fast photonic integrated circuits.

Fast and low-power thermooptic switch on thin silicon-on-insulator

Discussion

Member takes

Implication

Key Points

Cite This Study

Fast and low-power thermooptic switch on thin silicon-on-insulator

Discussion

Member takes

Implication

Key Points

Cite This Study

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