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Although selective dry etches exist for GaN, it is difficult to selectively etch AlN in heterostructures with other conventional III-N epitaxial materials. The reduction in etch rate resulting from the addition of 2%-16% scandium to Sc x Al 1-x N in conventional Cl 2 /BCl 3 /Ar inductively coupled plasma etching is presented. Smooth, epitaxial Sc x Al 1-x N layers are grown by RF-plasma-assisted molecular beam epitaxy directly on 4H-SiC substrates. The etch selectivity with respect to AlN is as high as 10.6 and 11.2 for x = 0.02 and 0.16, respectively, allowing Sc x Al 1-x N to act as an etch-stop layer with minimal misfit strain when grown within either AlN or GaN based heterostructures.
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Hardy et al. (2017) studied this question.
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