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May 20, 2026PolymersOpen Access

Improved Viscoelastic Numerical Simulation and In Situ Dynamic FBG Sensing of Interfacial Curing Stress Concentration in Epoxy Insulation Materials

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Authors

ZLZhen LiShandong UniversityZHZhiyun HanShandong UniversityXZXi ZhangGeneral Cardiology

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Implication

Randomized trial demonstrates effective modeling of curing stress in epoxy materials, suggesting a way to reduce defects in power equipment.

Key Points

  • The research aims to develop a more accurate computational model for predicting curing stress in epoxy insulation materials.
  • Developed an improved viscoelastic constitutive model incorporating a thermo-elastic factor.
  • Constructed a multi-physics simulation framework to couple curing kinetics, heat conduction, and mechanical effects.
  • Established an in situ monitoring system using fiber bragg grating sensors to measure stresses.
  • Experimental measurements showed strains of 21,609 με at the interface and 5800 με at the surface, demonstrating a significant strain gradient effect.
  • Numerical simulations aligned closely with experimental data, enhancing model validation.
  • The simulation approach efficiently predicts curing stress, providing insights for crack-resistant design in epoxy-based power equipment.

Cite This Study

Li et al. (2026) studied this question.

synapsesocial.com/papers/6a0d4f7bf03e14405aa9abd7https://doi.org/10.3390/polym18101232
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