3D micromachined devices based on polyimide joint technology

A novel and simple technology for making robust 3D silicon structures with small radii of bending has been developed and investigated. The proposed self-assembling method of bending 3D structure out-of-plane, without the use of interlocking braces is based on thermal shrinkage of polyimide in V-grooves. The static bending angle for the permanent out-of-plane rotated structure can be chosen and well controlled over a wide range by varying the curing temperature of the polyimide and the number of V-grooves in the joint.