The ferroelectric SrBi2Ta2O9 (SBT) and YMnO3 buffer layers for the metal/ferroelectric/ insulator/semiconductor (MFIS) structure were deposited using pulsed-laser ablation and metalorganic chemical vapor deposition, respectively. Memory windows of the MFIS structure were in the range of 0.3–1.5 V when the gate voltage varied from 2 to 6 V. There were no reactions between ferroelectric SBT and Si in the MFIS structure annealed at 900 °C. The YMnO3 buffer layer plays an important role in alleviating the interdiffusion between elements of SBT and Si. The proposed MFIS structure of Pt/200 nm–SBT/25 nm–YMnO3/Si is attractive for nondestructive read-out ferroelectric random access memory applications.
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Choi et al. (1999) studied this question.
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