We have developed an integration architecture for high‐resolution organic‐TFT (OTFT) arrays with top pixel electrodes on a plastic film. In this architecture, no damage isolation method of organic semiconductor (OSC) in a photolithographically defined resolution is employed. All the insulators in the backplane consist of organic polymers, enhancing both the mechanical flexibility of the backplane and the manufacturing throughput. These technologies have been successfully applied to produce a flexible, full‐color and top‐emission active‐matrix organic light‐emitting diode (AM‐OLED) display on a plastic substrate with a resolution of 80 ppi.
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Yagi et al. (2007) studied this question.
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