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A review of particle-solid processes pertinent to modelling plasma-wall interactions is presented, and sets of recommended data are given. Analytic formulas are used where possible; otherwise, data are presented in the form of tables and graphs. The incident particles considered are e − , H, D, T, He, C, O, and selfions. The materials include the metals aluminum, beryllium, copper, molybdenum, stainless steel, titanium, and tungsten and the nonmetals carbon and TiC. The processes covered are light ion reflection, hydrogen and helium trapping and detrapping, desorption, evaporation, sputtering, chemical effects in sputtering, blistering caused by implantation of helium and hydrogen, secondary electron emission by electrons and particles, and arcing.
Langley et al. (Sun,) studied this question.