A millimeter-wave bandpass waveguide filter using a width-stacked silicon bulk micromachining approach

A 30-GHz bandpass filter is realized in a novel waveguide topology, through the use of bulk micromachining of standard (low-resistivity) silicon wafers. In this new design, the width of the rectangular waveguide structure is created through the stacking of etched silicon wafer pieces. This width-stacking approach eliminates the presence of convex corners in the design, resulting in more controllable etching. Also, this design enables the simple implementation of the split-block technique, which alleviates Ohmic contact resistance issues. This latter aspect, combined with a double-sided etching strategy that enables deep cavities to be formed, leads to very high-Q silicon micromachined resonators (Q/sub 0//spl ap/4500). A three-cavity bandpass filter was fabricated and tested leading to a deembedded insertion loss of 1dB at a center frequency of 29.7GHz, with a 3-dB bandwidth of 0.654GHz (2.2%). These results validate this new micromachined waveguide approach, and demonstrates a significant improvement over other millimeter-wave micromachined waveguide filters.