Formation and Evaluation of Electroless Plated Ru Film for Fine Interconnect Application

Key Points

• The aim is to form and evaluate an electroless plated ruthenium (Ru) film for use in fine interconnect applications.
• Pd catalyst adsorption treatment was performed using Melplate Conditioner 1101 following substrate cleaning.
• Substrates were immersed in Ru electroless plating bath at temperatures between 45-65°C for film deposition.
• Ru (III) chloride was used as a metal salt, and hydrazine hydrate served as the reducing agent.
• Electroless plated Ru films showed improved adhesion and uniformity for fine interconnect applications.