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In this paper, we present a cost-effective chip-scale packaging solution for a 60-GHz industrial-scientific-medical band receiver (Rx) and transmitter (Tx) chipset capable of gigabit-per-second wireless communications. Envisioned applications of the packaged chipset include 1-3-Gb/s directional links using amplitude shift-keying or phase shift-keying modulation and 500-Mb/s-1-Gb/s omni-directional links using orthogonal frequency-division multiplexing modulation. This paper demonstrates the first fully package-integrated 60-GHz chipset including receive and transmit antennas in a cost-effective plastic package. A direct-chip-attach (DCA) and surface mountable land-grid-array (LGA) package technology is presented. The size of the DCA package is 7/spl times/11 mm/sup 2/ and the LGA package size is 6/spl times/13 mm/sup 2/. Optionally, the Tx and Rx chip can be packaged together with Tx and Rx antennas in a combined 13/spl times/13 mm/sup 2/ LGA transceiver package.
Pfeiffer et al. (Tue,) studied this question.
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