Study on the Preparation of Polyaniline/Nickel Powder/Polyurea Composite Conductive Films

Conductive polymer composite (CPCs) generally fail to balance high strength‐toughness and electrical conductivity simultaneously. Herein, ternary polyaniline/nickel powder/polyurea (PANI/Ni/Polyurea) CPC films were prepared via blending, with high‐performance polyurea as the flexible matrix and PANI/nickel powder as synergistic conductive fillers. Characterizations of microstructure, chemical structure, mechanical/electrical properties, and thermal stability revealed that polar groups on PANI chains form hydrogen bonds with polyurea, improving the interfacial compatibility of nickel powder with the matrix and inhibiting nickel powder agglomeration. At 20 wt% Ni and 1 wt% PANI, the composite film achieved optimal overall performance: a tensile strength of 23.7 MPa, an electrical conductivity of 0.00319 S/cm, and a 5% mass loss temperature 42°C higher than pure polyurea. This realizes the synergistic optimization of electrical conductivity, mechanical properties, and thermal stability, and the resultant film meets the potential application demands of flexible electronics, intelligent sensing, electromagnetic shielding, and other related fields.