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June 12, 2026PolymersOpen Access

Numerical Analysis and Strain Monitoring of the Curing Process in Ring-Shaped CFRP Components

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Authors

YTYanhui TianBDBenjie DingJDJianke Du

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Overview

Randomized trial demonstrates strain monitoring during curing of CFRP components, indicating effective modeling.

Key Points

  • This research aims to analyze and monitor the curing process of ring-shaped CFRP components using numerical methods.
  • Conducted strain monitoring experiments with embedded FBG sensors during curing.
  • Characterized curing kinetics and mechanical properties of LD-2184 epoxy resin via DSC and tensile testing.
  • Developed a coupled numerical model simulating heat conduction and curing deformation using ABAQUS.
  • The elastic modulus of fully cured resin was 2.810 GPa and coefficient of thermal expansion was 6.060 × 10−5 K−1.
  • Total strain varied along thickness due to mold constraint, with a 7.15% difference between measured and simulated strain.
  • Thermo-chemical strain remained similar in inner and outer regions of the composite ring.

Cite This Study

Tian et al. (2026) studied this question.

synapsesocial.com/papers/6a2ba3d18101cf8926f025bchttps://doi.org/10.3390/polym18121447
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