Combination and integration of innovative components for system benefits of an automotive high power density eAxle

This paper introduces a novel inverter architecture with an embedded power module for next-generation 1200 V Silicon Car-bide (SiC) semiconductor based electric axle (eAxle) systems, targeting improved integration, power density and efficiency. Pre-investigations of customer installation constraints identified stable geometric features in electric machine and gearbox components, enabling a modular design approach with standardized interfaces for flexible and scalable solutions. The embedded inverter integrates power semiconductors within a laminated organic Printed Circuit Board (PCB), reducing parasitic inductances through chip-near gate driving and enhancing switching performance. A Polymer Multilayer Capacitor (PML) technology reduces DC-link loop inductance by distributing smaller capacitors within the inverter housing, contributing to a 42 % reduction in loop inductance and a 36 % decrease in switching losses compared to conventional SiC power modules. Despite a non-optimized control strategy the motor dynamometer testing and Worldwide harmonized Light vehicles Test Procedure (WLTP)[1] cycle simulations demonstrate that the new design achieves 0.88 Wh per km less energy consumption than current series models. These results highlight the benefits of advanced packaging and modularity in developing compact, efficient and reliable eAxle systems for future electric mobility.