Structured review identifies thermal fatigue mechanisms and gaps in reliability for sensor fusion housings, suggesting improvements.
Autonomous driving sensor fusion housings (SFHs) integrate LiDAR, radar, camera, and computing modules within a shared mechanical and thermal enclosure. This review examines how coefficient of thermal expansion (CTE) mismatch among housing polymers, aluminum heat spreaders, substrates, and solder joints can contribute to interfacial delamination, solder joint fatigue, optical misalignment, and Thermomechanical Coupling Interference (TMCI). Using a structured narrative review of 99 publications and authoritative standards from primarily 2009 to 2026, the article organizes the evidence into a 4 × 4 taxonomy linking four failure mechanisms with experimental, computational, AI/ML, and qualification-oriented approaches. The review explicitly distinguishes direct literature evidence, transferred package-level evidence, model-based extrapolation, and author-derived conceptual estimates. Accordingly, TMCI temperature increments, sensor spacing values, optical drift estimates, and lifetime projections are discussed only as case-specific screening-level hypotheses unless directly validated in the cited literature. Five research gaps are identified: standardized multi-sensor TMCI validation, aging-corrected material and solder fatigue databases, long-term qualification of thermally conductive nanocomposites, SFH-specific validation of physics-informed digital twins, and integrated multi-failure testing. The contribution of this article is therefore primarily structural and agenda setting: it clarifies what is supported by direct evidence, what is transferred from adjacent domains, and what remains to be validated before robust SFH-level reliability guidance can be established.
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Lee et al. (2026) studied this question.
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