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July 1, 1995IEEE Electron Device Letters

Thermal detection of device failure by atomic force microscopy

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Authors

JLJie-Wei LaiUniversity of California, Santa BarbaraMCM. ChandrachoodShiv Nadar UniversityAMA. Majumda

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Cite This Study

Lai et al. (1995) studied this question.

synapsesocial.com/papers/6a5bce9fec0f450dc43ae76fhttps://doi.org/10.1109/55.388718
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