Electromechanical docking and undocking mechanisms for thin-film robotic and electronic modules based on kinetic electronics

Reconfigurable module-level interconnection across small-scale robotic systems and thin-film electronic systems remains limited, particularly in terms of active connection formation, reversible mechanical coupling, and electrical continuity. In this study, we report active electromechanical docking and undocking mechanisms for thin-film robotic and electronic modules based on kinetic electronics. We developed a single-plane probe assembly mechanism and a separation module assembly mechanism. These mechanisms operate at 5–12 V and establish simultaneous mechanical coupling and electrical continuity that persist in the unpowered state. During docking, the probe mechanism achieved 10 mm deformation at 1.1 W, whereas the separation module mechanism exhibited a mean operating power of 0.43 W and a mean maximum holding force of 618 mgf (6.1 mN). These results demonstrate a proof-of-concept for reversible active electromechanical interconnection for thin-film module systems.