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We demonstrate an approach to significantly reduce the electrical resistivity in a polyurethane shape-memory polymer (SMP) filled with randomly distributed carbon black (CB). With an additional small amount of randomly distributed Ni microparticles (0.5vol%) in the SMP/CB composite, its electrical resistivity is only reduced slightly. However, if these Ni particles are aligned into chains (by applying a low magnetic field on the SMP/CB/Ni solution before curing), the drop of the electrical resistivity is significant. This approach, although demonstrated in a SMP, is applicable to other conductive polymers.
Leng et al. (Mon,) studied this question.