Parametric Optimization of Surface Roughness of Ni-W-P Electroless Coating Using Central Composite Design Coupled with Fuzzy Logic Approach

The present work studied SR of electroless Ni-W-P ternary alloy coatings on a Cu substrate. There is very little specific research conducted on the importance of reducing materials SR through Ni-W-P electroless coating, which further improves their mechanical properties. In this study, it was attempted to reduce the as-coated Ni-W-P Cu substrate surface SR by adopting DoE and optimizing the process parameters using CCD. The aim was to optimize the desired response controlled by multiple input parameters. ANOVA and regression analysis were implemented to indicate the significance of as-coated substrates parameters and their impact on the measured SR responses. From CCD optimization, optimal SR parameters were found to occur at low values. Furthermore, FL approach was employed to predict Ni-W-P electroless coating SR, as compared to experimental and CCD approaches. It was found that fuzzy measured values were in good agreement with experimental and CCD values. There was a small difference among all values, and response optimization predicted optimal conditions comparatively well. Therefore, the developed models can be effectively used to predict SR. Moreover, confirmation tests were performed to validate that CCD optimized levels and developed fuzzy models effectively represented SR. Optimized parameters characterization was done with the help of SEM and EDX. It was seen that globular shaped atoms were scattered all over the sample, while granular grains were more clear. From EDX, appropriate deposition of Ni-W-P substrate in Cu was found. Thus, it was concluded that Ni-W-P incorporation in the Cu substrate made a major contribution to the film morphology, enhancing the metal properties and reducing SR.