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September 17, 2018IEEE Journal of Emerging and Selected Topics in Power Electronics

Electrical Performance Advancement in SiC Power Module Package Design With Kelvin Drain Connection and Low Parasitic Inductance

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FYFei YangZWZhiqiang WangZLZhenxian Liang

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Yang et al. (2018) studied this question.

synapsesocial.com/papers/6a6ea29575498292b7084f8dhttps://doi.org/10.1109/jestpe.2018.2870248
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