Vertical microstrip transition for multilayer microwave circuits with decoupled passive and active layers

A novel broadband (including dc) microstrip-to-microstrip vertical transition for multilayer microwave circuits is proposed. This transition solves the problem of the discontinuity typically appearing in via hole transitions between two microstrip transmission lines in different layers. An analogy existing between this transition and a rectangular coaxial line is discussed. A parametric study alongside with the experimental results of the transition are presented. Reduction of local oscillator to radio frequency leakage in a mixer with this transition is demonstrated.