Answers are grounded in this paper and cite their sources.
CVD SiO2has been used as gate insulator for GaInAs n-channel inversion-mode MISFET's. By applying a rapid thermal annealing cycle with a maximum temperature of 700°C, the number of fast interface states could be strongly reduced, thus leading to stable device performance in the time range between 10-6and 10 s. The drain current drift for longer times, however, is not affected by the annealing step. A reduction of the dielectric deposition temperature down to 250°C, however, results in improved long-term stability with a drain current decrease of only 5 percent after 104s of operation at room temperature.
No takes yet. Share an insight, caveat, or question.
Selders et al. (1986) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: