Fabrication of mesoporous organosilica in a shallow nanotrench for low-k and high elastic modulus material application

Mesoporous organosilica was fabricated in a shallow nanotrench of 25 nm width and 400 nm depth by vapor phase synthesis. The high elastic modulus of filled organosilica could be obtained due to crosslinking and closed mesoporous structure. It also has high porosity and a well ordered mesoporous form, resulting in a low dielectric constant.