The operation of a bonded thickness mode trans- ducer is crucially affected by the quality of its bonding layer. Two new constants, the thickness coefficient < and the adhe- sion coefficient S, are introduced in order to numerically evalu- ate the quality of the bonding layer. The electrical input im- pedance curves of bonded transducers for various values of the new constants together with various values of electro-mechan- ical coupling coefficients are obtained and compared with data for experimental transducers. It has been found that these theoretical impedance curves can be used to diagnose the bond quality of the experimental transducers.
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Noguchi et al. (1973) studied this question.
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