The process stability of Pb(Zr, Ti)O 3 (PZT) sputtering was studied by observing film composition change as a function of the process duration ( e.g. integrating sputtering time). A useful method of controlling compositional stability was developed. It was found that the existence of a potentially grounded anode was effective to prevent the large variation of Pb contents in PZT thin films and improve the process stability of PZT sputtering.
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Suu et al. (1997) studied this question.
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