Answers are grounded in this paper and cite their sources.
Because high-dimensional wafer bin maps (WBMs) cause various features, it is difficult to search the similarity among WBMs via conventional pattern recognition methods. This study develops a novel morphology-based support vector machine for defective wafer detection. The experimental results demonstrate its usefulness in yield improvements on precision and computation cost.
No takes yet. Share an insight, caveat, or question.
Liao et al. (2013) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: