Total-Ionizing-Dose Effects on InGaAs FinFETs With Modified Gate-stack

We evaluate the total-ionizing-dose (TID) responses of InGaAs nMOS fin field-effect transistors (FinFETs) with a modified gate-stack irradiated with 10-keV X-rays under different gate biases. This modified InGaAs nMOS FinFET process shows decreased subthreshold leakage current and increased hysteresis in as-processed devices, and reduced hole trapping in irradiated devices, than first-generation development-stage devices. The reduction in subthreshold leakage current is attributed to changing the buffer layer from GaAs to In0.3Ga0.7As, thereby enhancing the material quality. Both the increased hysteresis in as-processed devices and reduced hole trapping in irradiated devices are attributed primarily to thinning the Al2O3layer that separates the HfO2from the InGaAs layers. This facilitates charge exchange with defects at the HfO2/Al2O3interface and reduces the percentage of radiation-induced holes that are generated in Al2O3and trapped in HfO2. The removal of a tungsten layer above the TiN gate reduces the interface dose enhancement.