Dual Damascene Interconnect of Copper and Low Permittivity Dielectric for High Performance Integrated Circuits

Dual Damascene Interconnect of Copper and Low Permittivity Dielectric for High Performance Integrated Circuits, Zhao, B., Feiler, D., Ramanathan, V., Liu, Q. Z., Brongo, M., Wu, J., Zhang, H., Kuei, J. C., Young, D., Brown, J., Vo, C., Xia, W., Chu, C., Zhou, J., Nguyen, C., Tsau, L., Dornisch, D., Camilletti, L., Ding, P., Lai, G., Chin, B., Krishna, N., Johnson, M., Turner, J., Ritzdorf, T., Wu, G., Cook, L.