What question did this study set out to answer?

Systematically evaluate how varying plasma deposition parameters—including temperature, power, and gas composition—influences the physical, chemical, and electrical properties of silicon dioxide films.

July 1, 1981Journal of The Electrochemical SocietyOpen Access

Characterization of Plasma‐Deposited Silicon Dioxide

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Systematically evaluate how varying plasma deposition parameters—including temperature, power, and gas composition—influences the physical, chemical, and electrical properties of silicon dioxide films.
Deposited silicon dioxide thin films by reacting silane and nitrous oxide in a parallel-plate, radial-flow plasma reactor across temperatures ranging from 100°C to 340°C and deposition rates of 200–360 Å/min.
Characterized films by measuring infrared spectra, density, etch rate, compressive stress, refractive index, step coverage, breakdown voltage, and annealing behavior in air at temperatures up to 400°C.
Synthesized films exhibited densities of approximately 2.3 g/cm³, refractive indexes near 1.47, breakdown fields of 4–10 MV/cm, and hydrogen contents of 2–9 atomic percent bonded as SiH, SiOH, and H2O.
Chemical etch rates were roughly twelve times faster than thermally grown silicon dioxide, with films deposited below 200°C or under high power displaying non-uniform etching suggestive of a two-phase mixture.
Step coverage was non-conformal with thinning along vertical step walls, while thermal annealing up to 400°C drove out hydrogen and decreased film density without triggering film cracking.

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Implication

Experimental study demonstrates parameter-dependent variation in plasma-deposited silicon dioxide films, highlighting the absence of simple correlations among material properties.

Cite This Study

Adams et al. (1981) studied this question.

synapsesocial.com/papers/6a779f6bd3a6aa87c6bddc57 https://doi.org/10.1149/1.2127680

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Implication

Experimental study demonstrates parameter-dependent variation in plasma-deposited silicon dioxide films, highlighting the absence of simple correlations among material properties.

Characterization of Plasma‐Deposited Silicon Dioxide

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Implication

Cite This Study

Characterization of Plasma‐Deposited Silicon Dioxide

Key Points

Discussion

Implication

Cite This Study

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