Semi-encapsulated spiral inductors for microelectromechanical systems (MEMS) applications have been designed, fabricated, and characterized using micromachining and electroplating techniques. The inductors are fabricated on a Pyrex glass wafer using a simple three mask process and have an area of 4 mm by 4 mm. Devices consist of electroplated copper conductor lines with width 50 /spl mu/m, thickness 25 /spl mu/m, and spacing 30 /spl mu/m; they are semi-encapsulated with an electroplated Ni-Fe (81%/19%) magnetic core. At the low frequency of 10 kHz, the inductance of the devices was measured as 1.5 /spl mu/H, while they exhibited a low resistance of only 3 ohms. Their low resistance and reasonably high inductance makes them ideal in MEMS applications as either sensors or actuators.
No takes yet. Share an insight, caveat, or question.
Sadler et al. (1997) studied this question.
Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context: