Answers are grounded in this paper and cite their sources.
Analytical study demonstrates reduced junction temperature variation in high-power silicon chips, indicating improved thermal management for compact electronics.
We propose a diamond-shaped interrupted microgrooved cooling fin to decrease the junction temperature variation across the chip. The analytical result indicates that the junction temperature variation decreses to less than 25% compared with a conventional paralles-plate-shaped cooling fins. This cooling structure is sufficient to cool high-power-consumption silicon chips.
No takes yet. Share an insight, caveat, or question.
Kishimoto et al. (1987) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: