Empowering semiconductor chips via diamond-integrated near-junction cooling

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Diamond-integrated near-junction cooling enhances the thermal management and overall performance of semiconductor chips. Novelty: ClaimNovelty.SYNTHESIS. Consensus alignment: ConsensusAlignment.NEUTRAL.

Wenjun Liang; Yang Lü

doi:10.1093/nsr/nwag482

August 11, 2026National Science ReviewOpen Access

Empowering semiconductor chips via diamond-integrated near-junction cooling

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Key Points

To evaluate diamond-integrated near-junction thermal management strategies for mitigating extreme heat accumulation in high-power semiconductor microelectronics.
Reviewed mechanisms of near-junction thermal transport and high thermal conductivity synthetic diamond integration with semiconductor substrates.
Analyzed device architectures and interface engineering approaches designed to minimize interfacial thermal resistance.
Demonstrated that placing synthetic diamond directly adjacent to active junction hot spots significantly accelerates heat extraction.
Identified critical interface bonding parameters required to reduce thermal boundary resistance across diamond-semiconductor heterointerfaces.

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Implication

Perspective review demonstrates diamond integrated near junction cooling strategies for high power semiconductor chips, highlighting superior thermal dissipation.

Abstract

Wenjun Liang, Yang Lu; Empowering semiconductor chips via diamond-integrated near-junction cooling, National Science Review, , nwag482, https://doi.org/10.

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Liang et al. (2026) studied this question.

synapsesocial.com/papers/6a7ec735b70b84ec8b913546 https://doi.org/10.1093/nsr/nwag482

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Empowering semiconductor chips via diamond-integrated near-junction cooling

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Empowering semiconductor chips via diamond-integrated near-junction cooling

Key Points

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