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The principal sources of fracture in ceramic polycrystals have been identified; they include surface cracks produced during surface finishing and voids, inclusions, or large grains generated during processing. The dominance of a specific fracture source depends on the microstructure, test temperature, and stress distribution. The origins of processing‐induced defects have been examined and certain dominant processing variables identified. Connections between processing and structural reliability have thereby been established.
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A.G. Evans (1982) studied this question.
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