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December 1, 1984IEEE Transactions on Components Hybrids and Manufacturing Technology

Copper/polyimide Materials System for High Performance Packaging

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Authors

RJRonald J. JensenMayo ClinicJCJennifer CummingsUniversity of California, San FranciscoHVH. VoraUnited States Air Force Research Laboratory

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Jensen et al. (1984) studied this question.

synapsesocial.com/papers/6a85591e90c4f21ff9d59933https://doi.org/10.1109/tchmt.1984.1136378
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Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Measurement of stresses generated in cured polyimide films1983 · 55 citations
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