Stress in NbCxN1-x Films Prepared by Reactive Rf Magnetron Sputtering

Stress in reactively sputter-deposited NbC x N 1- x films was measured. It was found that the stress in NbC x N 1- x films strongly depended on the total sputtering gas pressure P t . Films deposited at P t ≥2.0 Pa had very small stress values (<2.0×10 8 Pa). On the other hand, films deposited at P t ≤1.1 Pa had large compressive stress values. The results of X-ray diffraction measurements showed that the stress in NbC x N 1- x films was strongly related to the ratio of (111) and (200) grains in the films. We also observed the surface morphology of deposited films by scanning electron microscopy and found that the stress in deposited films is affected by the microstructure of the films.