We have developed a new method for fabrication of microstructures. Using a Si 3 N 4 membrane with small windows as a mask, a metal film with fine structure is vacuum deposited directly onto a substrate. By means of piezoelectric actuators which slide the mask on the substrate, we have fabricated an array of Al/AlO x /Al small tunnel junctions. This method has the important advantage that the lift-off process after vacuum deposition is not necessary. The use of rf plasma oxidation to form the tunnel barrier is another advantage of this method. We have fabricated a Ni/NiO/Fe small junction array with a junction area of 0.01 µ m 2 using plasma oxidation and double-angle evaporation.
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Ono et al. (1996) studied this question.
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