Isolation blocking voltage of nitrogen ion-implanted AlGaN/GaN high electron mobility transistor structure

Nitrogen ion-implanted AlGaN/GaN high electron mobility transistor structures showed an isolation blocking voltage of 900 V with a leakage current at 1 μA/mm across an implanted isolation-gap of 10 μm between two Ohmic pads. The effect of implanted gap distance (1.7, 5, or 10 μm) between two Ohmic contact pads was evaluated. The isolation current density was determined to be solely dependent on the applied field between the contact pads. A model using a combination of resistive current and Poole–Frenkel current is consistent with the experimental data. The resistance of the isolation implantation region significantly decreased after the sample was annealed at temperatures above 600 °C.