Modeling Multiple Vias With Arbitrary Shape of Antipads and Pads in High Speed Interconnect Circuits

This letter successfully extends the full-wave semi-analytical approach, based on Foldy-Lax multiple scattering equations and modal expansions, to solve massively-coupled multiple vias with arbitrary shape of antipads and pads in high speed interconnect circuits. The magnetic frill current at the antipad aperture is calculated using finite difference method. Numerical examples of as many as 16-by-16 via array demonstrate that this approach is able to model the multiple vias problem at about five thousand times faster than Ansoft HFSS and yet is within 5% difference of accuracy up to 20 GHz.