Be is implanted into an n-InGaAs epitaxial layer. Both electrical and atomic profiles indicate that Be in-diffusion occurs during annealing, resulting in a p layer thicker than that desired. A co-implant of P or As with Be significantly reduces this Be in-diffusion resulting in shallow (2000 Å) p+-n junctions with 4×1018 cm−3 surface hole concentration and 70% electrical efficiency.
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Wang et al. (1988) studied this question.
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