Details are presented of the design of a small DC planar magnetron source and its use in a research-scale UHV getter sputter deposition system. The system has been used for depositing a range of refractory materials as well as some metal multilayer structures (single crystal, polycrystalline and amorphous). For some of these structures a relatively high sputtering pressure is required and a study has been made of the deposition rate as a function of pressure for a range of different elements. This illustrates the effect of the momentum and energy transfer of the sputtered atoms as they travel from the target to the substrate.
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Somekh et al. (1988) studied this question.
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