This study was undertaken to determine the locus of failure between a fully cured (up to 400°C) PMDA-ODA polyimide and SiO2 surface. We have shown that an interfacial layer is formed between the bulk polyimide and the substrate surface. The chemistry of this 2 nm-thick layer is different from that of the polymer interface surface of the polyimide film and of the bulk polymer. The locus of failure is at the interface of the interfacial layer and the bulk polyimide film.
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Buchwalter et al. (1986) studied this question.
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