⌘+K

Pulse Explore Clubs Researchers Journals

Home Clubs Explore

January 1, 1990IEEE Transactions on Components Hybrids and Manufacturing Technology

LED array modules by new technology microbump bonding method

View Full Paper

Ask AI

Bookmark

Share

Authors

KHKenzo HATADAPanasonic (Japan)HFH. FujimotoIntel (United States)TOTakafumi OchiNippon Koei (Japan)

Discussion

Loading...

Member takes

Implication

Key Points

Key points are not available for this paper at this time.

Cite This Study

HATADA et al. (1990) studied this question.

synapsesocial.com/papers/6a8968dea4df84145ecb089a https://doi.org/10.1109/33.58854

View Full Paper

Ask AI

Bookmark

Share