Self-aligned flip-chip packaging of tilted semiconductoroptical amplifier arrays on Si motherboard

An optical self-aligned flip-chip packaging technique for tilted semiconductor optical amplifier arrays is reported. It uses a Si motherboard with V-grooves for self-alignment between the tilted SOA array and angle polished fibre arrays. Fibre-to-fibre gain of 14 ± 1 dB and ripple ±0.1 dB without antireflection coating on the fibres have been achieved.