Formation of SiGe/Si heterostructures by germanium ion implantation was investigated. A germanium-implanted layer was grown epitaxially in the solid phase by thermal annealing. Two kinds of crystalline defects were observed. One is a misfit dislocation, and the other is a residual dislocation caused by ion bombardment. The p-n junction formed in the SiGe layer has a leakage current three orders of magnitude larger than that of a pure Si p-n junction fabricated with an identical process except for the Ge+ implantation. Carbon doping in the SiGe layer improves its crystalline quality and the junction characteristics.
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Fukami et al. (1990) studied this question.
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