Freestanding GaN‐substrates and devices

Various physical aspects and potential applications of the laser-induced separation of GaN epilayers from their sapphire substrate are reviewed. The effect of short laser pulses on the thermal decomposition of GaN and possible applications of the laser-induced dissociation of GaN for fast etching of this material is discussed. Particular emphasis is placed on the defect-free delamination of large area GaN films with thicknesses ranging from 3 to 300 μm from sapphire substrates. The use of the resulting freestanding GaN films in device technology and homoepitaxy of III-nitrides are outlined. Specific examples are the flip-chip bonding of freestanding InGaN/GaN LEDs to a silicon submount and the production of pseudosubstrates for the homoepitaxy of high quality GaN epilayers. (© 2003 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)