A low-temperature IC-compatible process for fabricating surface-micromachined metallic microchannels

In this paper, a low-temperature integrated-circuit (IC)-compatible process for fabricating metallic microchannels is described. Arrays of 1-100 metallic microchannels have been fabricated on silicon and glass substrates. The process can be extended to many planar substrate materials including polymers and ceramics. The microchannels are formed using microelectro-formed metals. The microchannels demonstrated in this paper use nickel as the structural material and gold as the surface coating on the inside walls of the microchannels. The inner dimensions of the individual microchannels fabricated to date range from 30 /spl mu/m to 1.5 mm in width, 0.5 mm to several centimeters in length, and 5-100 /spl mu/m in thickness. The wall thickness ranges from 5 to 50 /spl mu/m. The microchannel fabrication technology enables the fabrication of surface microchannels with a relatively large cross-sectional area. The metallic microchannels can be fabricated to extend from the substrate edge. Interfacing schemes are given for attaching external pressure feeds.