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June 27, 1988Applied Physics LettersOpen Access

Room-temperature copper metallization for ultralarge-scale integrated circuits by a low kinetic-energy particle process

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Authors

TOT. OhmiTohoku UniversityTST. SaitoROHMTSTugumichi ShibataTohoku University

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Ohmi et al. (1988) studied this question.

synapsesocial.com/papers/6a9019316e7e048e0989cc69https://doi.org/10.1063/1.99542
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