Understanding crack growth in solder joints is important for predicting the fatigue life of solder interconnects. In this paper, crack propagation in solder joints made of two solder alloys, 62Sn/36Pb/2Ag (by weight), a commonly used solder paste for SMT reflow applications, and 96.5Sn/3.5Ag (by weight), a lead‐free solder alloy, was examined during thermal cycling. Based on these observations, the rate of crack propagation was estimated. Microstructural changes in the solder during thermal cycling were also studied.
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Dongkai Shangguan (1999) studied this question.
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