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August 12, 2026Soldering and Surface Mount Technology

Reliability analysis of large area sintered Cu interconnects based on simulation and thermal shock test

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Authors

JGJiaqi GaoYLYang LiuYGYue Gao

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Overview

Randomized trial evaluates thermomechanical reliability of sintered copper interconnects in automotive power modules, indicating strong performance under thermal cycling.

Key Points

  • Assess the thermomechanical reliability of large-area sintered Cu interconnects for automotive applications and determine optimal sintering layer thickness.
  • Combined finite element simulation and experimental validation to analyze reliability.
  • Thermal shock tests (−40 °C to 125 °C) and shear strength tests to evaluate performance under operational conditions.
  • Identification of optimal layer thickness based on stress-strain results and economic feasibility.
  • Optimal sintering layer thickness determined to be 100 µm.
  • Shear strength of >25 MPa observed with only 1.575% delamination after 1,000 thermal shock cycles.
  • Demonstrated high reliability with negligible crack propagation, suitable for next-generation electronics.

Cite This Study

Gao et al. (2026) studied this question.

synapsesocial.com/papers/6a7c20a306a85aed514b788ehttps://doi.org/10.1108/ssmt-11-2025-0071
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Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Reliability study of large-area sintered Cu for power electronic packaging2026
  2. 2Reliability of Copper Sintered Interconnects under Extreme Thermal Shock Conditions2024 · 1 citations
  3. 3Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock2024 · 7 citations
  4. 4Understanding Cu Sintering and Its Role on Corrosion Behaviour for High-Temperature Microelectronic Application2024
  5. 5Thermal Stability and Microstructural Evolution of Cu Joints with an Ultra-Thin Sintered Layer2026