What question did this study set out to answer?

This study aims to examine the reliability and fracture behavior of large-area sintered copper in power electronic packaging, focusing on edge effects.

June 4, 2026Soldering and Surface Mount Technology

Reliability study of large-area sintered Cu for power electronic packaging

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Authors

YXYi XieGuilin University of Technology JHJian HuangGuilin University of Technology DYDaoguo YangGuilin University of Technology

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Implication

Reliability study investigates fracture behavior in sintered copper, highlighting implications for power electronics.

Key Points

This study aims to examine the reliability and fracture behavior of large-area sintered copper in power electronic packaging, focusing on edge effects.
Fabricated sintered copper joints of varying sizes (8 × 8 mm², 16 × 16 mm², 32 × 32 mm²)
Evaluated microstructures, mechanical properties, and warpage behavior under various conditions
Conducted simulations to analyze stress from thermal expansion mismatch
Shear strength decreased from 105.18 MPa to 61.36 MPa as bonding area increased from 8 × 8 mm² to 32 × 32 mm²
Edge porosity increased significantly from 13.92% to 37.73% after thermal cycling
Simulation and experimental results showed a 6% error margin in warpage measurements.

Cite This Study

Xie et al. (2026) studied this question.

synapsesocial.com/papers/6a211780d499ed480b170489 https://doi.org/10.1108/ssmt-03-2026-0020

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Reliability study of large-area sintered Cu for power electronic packaging

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Key Points

Cite This Study

Reliability study of large-area sintered Cu for power electronic packaging

Discussion

Member takes

Implication

Key Points

Cite This Study

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